Necessary equipment for semiconductor chip manufacturing


Coat Developer Equipment

ZHT-200, 8 & 6 inches or compatible

  • Applicable wafer size: 8 & 6 inches or compatible
  • Equipment size: 1850*1700*2600mm (Single block)
    3110*1700*2500mm (Open-type dual block)
  • Warping degree: ±1mm
  • Application fields: Silicon based, silicon carbide, gallium nitride, filters, gallium arsenide, advanced packaging and other fields

Product Advantages:

  1. Stacked modular layout maximizes output per unit of floor space
  2. Fully in-house developed architecture with secure, independently controlled software source code, deep integration with customer IT systems, and expanded data interfaces
  3. Purpose-built optimization for specialty substrates and thick-resist processes
  4. Ideally suited to domestic production lines for power semiconductors, third-generation semiconductors, and advanced packaging
  5. A high proportion of domestically sourced core components significantly reduces costs and delivers clear total cost of ownership (TCO) advantages throughout the equipment lifecycle
  6. Highly customizable configurations give customers greater flexibility and choice
  7. Dual robot arms share the workload, reducing fatigue risk
  8. No additional aligner unit is required, delivering greater transfer precision, flexibility, and reliability
  9. Stable control of chamber flow and pressure reduces the risk of thick-resist defects
  10. Comprehensive service support, including local service and proactive maintenance

Technical Parameters:

  1. Speed range: 0-6000rpm
  2. Acceleration range: 0-50000rpm/sec
  3. Speed accuracy: ± 1rpm
  4. Hot plate temperature range: 50-200 ℃
  5. Temperature uniformity of hot plate:
    50.0℃ ~ 120.0℃ : Range ≤ 0.4℃
    120.1℃ ~ 150.0℃ : Range ≤ 0.8℃
    150.1℃ ~ 200.0℃ : Range ≤ 1.2℃
  6. Cold Plate Temperature Range: 20-30℃
  7. Uniformity of cold plate temperature: ±0.2℃
  8. Applicable photoresist: Max20000CP
  9. Rubber pump type: Cylinder/Motor Type pump
  10. Photoresist or developer tubing: PFA
  11. Traffic monitoring: Flowmeter + Contra ejaculation sensor/Fin flow/ ultrasonic flowmeter


Coat Developer Equipment

ZHT-150

  • Applicable wafer size: 6 & 4 inches or compatible
  • Equipment size: 1750*1820*2850mm
  • Warping degree: ±0.3mm
  • Application fields: optical communication, compound semiconductors, power devices, Micro LEDs, etc

Product Advantages:

  1. Integrated design, with small equipment footprint and high stability
  2. Able to support G-line and I-Line processes
  3. Customized function development can be carried out according to customer requirements
  4. Localization of components with high cost-effectiveness
  5. Able to support SECS communication

Technical Parameters:

  1. Speed range: 0-6000rpm
  2. Acceleration range: 0-50000rpm/sec
  3. Speed accuracy: ± 1rpm
  4. Hot plate temperature range: 50-200 ℃
  5. Temperature uniformity of hot plate:
    50.0℃ ~ 120.0℃ : Range ≤ 0.4℃
    120.1℃ ~ 150.0℃ : Range ≤ 0.8℃
    150.1℃ ~ 200.0℃ : Range ≤ 1.2℃
  6. Cold Plate Temperature Range: 20-30℃
  7. Uniformity of cold plate temperature: ±2℃
  8. Applicable photoresist: Max 800CP
  9. Rubber pump type: Cylinder/Motor Type pump
  10. Photoresist or developer tubing: PFA
  11. Traffic monitoring: Flowmeter + Contra ejaculation sensor


Coat Developer Equipment

ZHT-300, 12 & 8 inches or compatible

Application fields: silicon-based semiconductors, compound semiconductors (GaAs, GaN, SiC, filters), MEMS, advanced packaging, and other fields.

Product advantages:

  1. Stacked modular layout maximizes output per unit of floor space
  2. Fully in-house developed architecture with reliable, independently controlled software source code, deep integration with customer IT systems, and expanded data interfaces
  3. Supports a wide range of chemical processes for front-end fabrication and packaging, meeting multilayer process requirements
  4. Supports substrates with various structures and thicknesses, accommodating both transparent and opaque wafers
  5. A high proportion of domestically sourced core components significantly reduces costs and delivers clear total cost of ownership (TCO) advantages throughout the equipment lifecycle
  6. Highly customizable configurations give customers greater flexibility and choice
  7. Dual robot arms share the workload, reducing fatigue risk
  8. No additional aligner unit is required, delivering greater transfer precision, flexibility, and reliability
  9. Stable control of chamber flow and pressure reduces the risk of thick-resist defects
  10. Comprehensive service support, including local service and proactive maintenance

Technical Parameters:

  1. Speed range: 0-4000rpm
  2. Acceleration range: 0-50000rpm/sec
  3. Speed accuracy: ± 1rpm
  4. Hot plate temperature range: 50-200 ℃
  5. Temperature uniformity of hot plate:
    50.0℃ ~ 120.0℃ : Range ≤ 0.6℃
    120.1℃ ~ 150.0℃ : Range ≤ 0.8℃
    150.1℃ ~ 200.0℃ : Range ≤ 1.2℃
  6. Cold Plate Temperature Range: 20-30℃
  7. Uniformity of cold plate temperature: ±0.2℃
  8. Applicable photoresist: Max: 20000CP
  9. Rubber pump type: Cylinder/Motor Type pump
  10. Photoresist or developer tubing: PFA
  11. Traffic monitoring: Flowmeter + Contra ejaculation sensor/Finflow/ ultrasonic flowmeter


Coat Developer Equipment

HST-300, 12 & 8 inches or compatible

  • Applicable wafer size: 12 & 8 inches or compatible
  • Equipment dimensions: 5890(D) x 2425(W) x 3300(H) mm
  • Application fields: silicon-based semiconductors, compound semiconductors (GaAs, GaN, SiC, filters), MEMS, advanced packaging, and other fields.

Product advantages:

  1. Supports interfacing with Canon, Nikon, and ASML lithography machines
  2. Front-end supports KrF and ArF processes; back-end supports I-line and PI processes
  3. Five-layer stacked frame structure, small footprint
  4. Adopts a brand-new architecture, WPH > 250
  5. 20 spin units, 60 hot/cold plates
  6. Equipment configuration can be customized according to customer needs
  7. Supports TRMS and EAP automation systems
  8. Supports SECS communication and AMHS systems
  9. SVID output available, supports FDC
  10. Supports OHT overhead hoist transport