Coat Developer Equipment

6 & 4 inch or compatible

  • Applicable wafer size: 6 & 4 inches or compatible
  • Equipment size: 1750*1820*2850mm
  • Warping degree: ±0.3mm
  • Application fields: optical communication, compound semiconductors, power devices, Micro LEDs, etc

Product Advantages:

  1. Integrated design, with small equipment footprint and high stability
  2. Able to support G-line and I-Line processes
  3. Customized function development can be carried out according to customer requirements
  4. Localization of components with high cost-effectiveness
  5. Able to support SECS communication

Technical Parameter:

  1. Speed range: 0-6000rpm
  2. Acceleration range: 0-50000rpm/sec
  3. Speed accuracy: ± 1rpm
  4. Hot plate temperature range: 50-200 ℃
  5. Temperature uniformity of hot plate:
    50.0℃ ~ 120.0℃ : Range ≤ 0.4℃
    120.1℃ ~ 150.0℃ : Range ≤ 0.8℃
    150.1℃ ~ 200.0℃ : Range ≤ 1.2℃
  6. Cold Plate Temperature Range: 20-30℃
  7. Uniformity of cold plate temperature: ±2℃
  8. Applicable photoresist: Max 800CP
  9. Rubber pump type: Cylinder/Motor Type pump
  10. Photoresist or developer tubing: PFA
  11. Traffic monitoring: Flowmeter + Contra ejaculation sensor

Independent research and development

  • Software Running
  • Mechanical Transmission
  • Circuit Module
  • Unit for Coating
Compound Semiconductor

Process capacity: > 0.18um
Products: Gallium Arsenide (GaAs),
Gallium Nitride (GaN),
Silicon Carbide (SiC), Filter (Filter)

Microcomputer
Semiconductor

Process capacity: > 0.18um
Product: MEMS

Silicon-based Semiconductor

Process capacity: > 90nm
Products: IGBT, CMOS, MPU, MCU,
DSP, RAM, ROM, Flash