Products

• Applicable wafer size: 8 & 6 inches or compatible
• Equipment size: 1850*1700*2600mm (Single block)
  3110*1700*2500mm (Open-type dual block)
• Warping degree: ±1mm
• Application fields: Silicon based, silicon carbide, gallium nitride, filters, gallium arsenide, advanced packaging and other fields

Product Advantages:

1. Stacked modular layout maximizes output per unit of floor space
2. Fully in-house developed architecture with secure, independently controlled software source code, deep integration with customer IT systems, and expanded data interfaces
3. Purpose-built optimization for specialty substrates and thick-resist processes
4. Ideally suited to domestic production lines for power semiconductors, third-generation semiconductors, and advanced packaging
5. A high proportion of domestically sourced core components significantly reduces costs and delivers clear total cost of ownership (TCO) advantages throughout the equipment lifecycle
6. Highly customizable configurations give customers greater flexibility and choice
7. Dual robot arms share the workload, reducing fatigue risk
8. No additional aligner unit is required, delivering greater transfer precision, flexibility, and reliability
9. Stable control of chamber flow and pressure reduces the risk of thick-resist defects
10. Comprehensive service support, including local service and proactive maintenance

Technical Parameter:

1. Speed range: 0-6000rpm
2. Acceleration range: 0-50000rpm/sec
3. Speed accuracy: ± 1rpm
4. Hot plate temperature range: 50-200 ℃
5. Temperature uniformity of hot plate:
   50.0℃ ~ 120.0℃ : Range ≤ 0.4℃
   120.1℃ ~ 150.0℃ : Range ≤ 0.8℃
   150.1℃ ~ 200.0℃ : Range ≤ 1.2℃
6. Cold Plate Temperature Range: 20-30℃
7. Uniformity of cold plate temperature: ±0.2℃
8. Applicable photoresist: Max20000CP
9. Rubber pump type: Cylinder/Motor Type pump
10. Photoresist or developer tubing: PFA
11. Traffic monitoring: Flowmeter + Contra ejaculation sensor/Fin flow/ ultrasonic flowmeter