Products

Application fields: silicon-based semiconductors, compound semiconductors (GaAs, GaN, SiC, filters), MEMS, advanced packaging, and other fields.

Product advantages:

1. Stacked modular layout maximizes output per unit of floor space
2. Fully in-house developed architecture with reliable, independently controlled software source code, deep integration with customer IT systems, and expanded data interfaces
3. Supports a wide range of chemical processes for front-end fabrication and packaging, meeting multilayer process requirements
4. Supports substrates with various structures and thicknesses, accommodating both transparent and opaque wafers
5. A high proportion of domestically sourced core components significantly reduces costs and delivers clear total cost of ownership (TCO) advantages throughout the equipment lifecycle
6. Highly customizable configurations give customers greater flexibility and choice
7. Dual robot arms share the workload, reducing fatigue risk
8. No additional aligner unit is required, delivering greater transfer precision, flexibility, and reliability
9. Stable control of chamber flow and pressure reduces the risk of thick-resist defects
10. Comprehensive service support, including local service and proactive maintenance

Technical Parameters:

1. Speed range: 0-4000rpm
2. Acceleration range: 0-50000rpm/sec
3. Speed accuracy: ± 1rpm
4. Hot plate temperature range: 50-200 ℃
5. Temperature uniformity of hot plate:
   50.0℃ ~ 120.0℃ : Range ≤ 0.6℃
   120.1℃ ~ 150.0℃ : Range ≤ 0.8℃
   150.1℃ ~ 200.0℃ : Range ≤ 1.2℃
6. Cold Plate Temperature Range: 20-30℃
7. Uniformity of cold plate temperature: ±0.2℃
8. Applicable photoresist: Max: 20000CP
9. Rubber pump type: Cylinder/Motor Type pump
10. Photoresist or developer tubing: PFA
11. Traffic monitoring: Flowmeter + Contra ejaculation sensor/Finflow/ ultrasonic flowmeter